A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.
They offer test services for many devices and designs that are used in Mordern day Electronic Gadgets that have application specific integrated circuits, memory devicea, and mixed signal and RF sections.
Amkor also offers IC and Semiconductor Test Services. The also provide IC Package Design Services and complete turnkey solutions.
Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates.
This IC packaging technology is applicable for high pincount and / or high performance ASICs.
The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product.
1900 South Price Road, Chandler AZ USA